Blind and Buried Vias for Multilayer Production

When PCB design density becomes so tight on a multilayer design that even small 150um or 200um through-holes tend to obstruct the layout of additional pads and traces, the use of blind and buried vias can be a helpful technique for gaining more usable surface area. Blind and/or buried vias are commonly used with micro ball-grid arrays, flip-chips, and large BGAs.

The tech paper describes the basic terminology of multilayer boards and links it to the LPKF in-house rapid prototyping. In addition, the paper gives a material recommendation for multilayer boards for an easier start.